Process training thin wire bonding
In this highly practical training course, we will show you the basic setup and operation of a wire bonder for manufacturing products. You will learn how to create new programs, what to look out for during image recognition, which errors you should avoid at all costs when setting up the machine and which typical problems you can expect to encounter in everyday practice.


















































































































































Is this seminar right for you?
This training is designed for users with 0-3 years of experience in wire bonding. It focuses on common thin wire bonding processes, such as ball-wedge and wedge-wedge. The training emphasizes practical work on the device and the process. Participants create bond contacts on prepared samples and optimize and check their bond quality by varying the parameters. Participants carry out these changes and optimizations independently, thereby gaining more confidence in handling and interpreting the process results.



What seminar topics can you expect?
Gain practical experience with parameter settings in the wire bonding process. Microscopes and testing equipment are available to analyze the connections. Conducting your own experiments on the machines allows you to observe the process and ask questions. Take advantage of the opportunity to bring your own samples, practice with them and learn more effectively.
You will learn how to set bond and loop parameters to ensure optimum bond quality. A central component of the seminar is mechanical testing methods, such as pull and shear tests, which evaluate the strength and reliability of wire-bonded connections. Additionally, we will teach you visual inspection techniques to identify and correct typical fault patterns early on. Along with the test procedures, you will gain valuable insights into programming bonding machines to efficiently control and adapt processes to different requirements.







What you will learn?
The seminar focuses on two thin-wire bonding processes: ball-wedge (gold wire) and wedge-wedge (typically aluminum wire). Each process step is presented individually and the adjustments that can be made in each case are demonstrated. The level of detail depends on the seminar group's skills and prior knowledge. Experiments determine the effects of individual bonding parameters (e.g., US power, bonding force, bonding time and loop parameters) and the influence of parameter settings. Participants work in two groups divided by process and quality. The two groups switch topics during the exercises.
The available wire bonders, microscopes and pull/shear testing devices allow participants to experience firsthand what constitutes a good wire bonded connection. These devices are equipped with cameras, allowing all participants to follow along on a large monitor. Process training offers plenty of opportunities for questions and discussions.

How wire bonding processes are implemented and optimized on automatic bonding equipment
What differences exist between ball-wedge and wedge-wedge processes and how these affect process control.
What characteristics you need to look for in order to assess the quality of a connection
How to best proceed with parameter adjustment
Tips for a functioning process environment
Who is this seminar for?

You want to acquire technology knowledge that will significantly accelerate your start and enable you to do more than just operate machines

You have no experience or have only been active in wire bonding for 1-2 years and need more guidance for your next steps.

You want to understand the influencing factors in your wire bonding processes even better and are looking for ways to analyze correlations efficiently

Your working field is process support, development, quality inspection or production.

You know the daily practice of process optimization in your company and you have the feeling that it could be even better

































































































Seminar Agenda: 2-Day Program
The time plan ensures that participants gain both theoretical knowledge and practical experience, enabling them to apply wire bonding technology effectively in their respective fields.
Inspection and pull test
Inspection and shear test
Tests on samples supplied by participants
Final discussion
Upcoming seminar dates
Reserve your spot today and elevate your expertise in wire bonding technology.

Process training
thin wire bonding
Small seminar group for individual questions and discussion
Compact learning in two days
Get out of the company's daily routine to focus fully on the seminar content
Network and share experiences
Clarify questions even better in direct conversation. Use samples you bring.
1.970 €
Prevent risks by making safe and informed decisions throughout the development process.
Engage in team-based training to maximize learning success and promote sustainable knowledge in your organisation.
Proven strategies and techniques that deliver real-world results, leading to more stable processes with higher yields.








































































Even more effective training with companions from the same team. Bring one or more other people with you, collect the price bonus and make your seminar even more effective by deepening what you have learned in the joint discussion.
30% price bonus
Practical day following your seminar to work on individual topics and consolidate what you have learnt. Plenty of time for practice on the bonding machine, including samples you bring along. For those who want to get the most out of their training.
997 €
For those who want the support and mentoring of a regular contact person beyond the seminar. Questions about wire bonding, whether related to a seminar or from day-to-day practice, can be raised in the group of participants at fixed dates.
670 €












































































































Customer voices
We carefully ensure that demand and performance are balanced and aligned with our customers’ needs.
Which of these challenges are you currently facing?
Which of these challenges are you currently facing?







Meet your expert trainer in wire bonding technology
You benefit from over 20 years of wire bonding experience, dedicated training rooms, and customized bonding equipment. Whether in 1:1 training or in groups of several participants, you will always have a front row seat.
With his clear presentation style, convincing rhetoric and vivid examples, your trainer knows how to make even complex techniques and contexts clear and universally understandable. This ability allows him to combine tried and tested content with motivational elements in an informative, entertaining and unique way. He creates a learning experience for the audience with many "aha" moments and full attention.






Frequently Asked Questions
The seminar will be held at Bond-IQ GmbH, Gustav-Meyer-Allee 25, 13355 Berlin, Germany. Detailed directions will be provided to all registered participants.
Registration can be completed online through our website. Simply enter your information and you'll receive a confirmation email with your individual quote. You can also register groups of participants. Based on the quote, you can then send an official order for your seminar and complete your registration.
We need your order on the basis of a seminar quotation you received from us. This order includes
An order number
The items ordered
Your billing address
An e-mail address to send the invoice to your VAT number (EU), tax number or other suitable company identification number
In exceptional cases, we will accept informal orders via e-mail. These exceptions are generally limited to companies with whom we have successfully invoiced in the past.
The registration deadline is 3 days prior to the seminar. We recommend early registration as space is limited and the seminar may fill up quickly. In urgent or exceptional cases, please contact us directly (+49 30 46069009, info@bond-iq.com) and we will find a solution.
Please make payments only after we have sent you an invoice. Payment is made to our account details listed on the invoice. Please do not send payment on the basis of our quote only.
We specify a payment term of 14 days on our invoices.
Yes, we provide lunch and refreshments during the seminar. Lunch is served in a restaurant that also offers dishes for vegetarians and vegans.
Cancellations received up to 6 weeks prior to the seminar are eligible for a full refund. After this date, partial refunds may be available. We also allow substitutions if you are unable to attend and wish to send someone in your place. When times are tough call us directly (+49 30 46069009) and we will find a solution.
Yes, parking is available at the seminar venue. These are non-public parking spaces for which the operator may charge a fee of 10 € per day. We encourage attendees to consider carpooling or using public transportation where possible.
Accommodation is not included in the seminar fee. A list of recommended hotels will be provided upon registration.
All necessary seminar materials will be provided, but personal note-taking is recommended and will be very beneficial.
Yes, you can bring your own samples (components, wires, tools). We will most likely have the opportunity to visually inspect these samples under an optical microscope. However, we cannot guarantee that bonding experiments will be performed on your samples. Although we particularly enjoy such live experiments, we also know that they can disrupt all schedules.
Tell us your ideas. We offer additional practical exercises directly afterwards (practical day), we can arrange additional individual consultations, we can build your prototypes together on the following days or carry out tests on your samples. If you contact us early enough and register in good time, you will have a great deal of flexibility in putting together your seminar.